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The ET-220XF high precision bake machine is a high-performance laboratory equipment equipped with precise temperature control, vacuum adsorption and superior heating uniformity to realize accurate temperature-controlled wafer baking. It is designed for substrates up to 6-inch wafer size. With compact footprint, the unit is perfectly suited for operation inside glove boxes.
Its maximum working baking temperature is 250°C. After thermal stabilization, temperature fluctuation is controlled within ±0.2°C with 0.1°C temperature resolution and surface temperature uniformity less than 1%. The instrument supports segmented linear programmable temperature control.
1. Technical Specifications
2. Product Features
- Diameter of heating plate: 170mm, compatible with maximum 6-inch wafer baking;
- Manually controlled vacuum adsorption to ensure tight contact between substrate and heating surface;
- High-precision digital temperature controller supporting segmented linear programmable temperature ramp;
- Full hard anodized aluminum housing with elegant appearance;
- Independent heating circuit for convenient start and stop of heating;
- Adopts special heat insulation design and long-life heating components with outstanding temperature uniformity;
- Comes with thermal radiation protective cover and microcrystalline thermal insulation panel for further improved thermal uniformity.
Please feel free to contact us for detailed documentation and any technical questions regarding the ET-60XF high precision bake machine.
3. Application & Usage
This wafer baking hot plate is mainly used in photolithography processes for soft bake after spin coating, post-exposure baking, hard bake after development, as well as wax melting for wafer dicing and die bonding.
