Basic Model Glue Baking Machine

The ET-150 basic glue baking machine is a high-performance laboratory equipment designed for precise temperature control, accurate timing and superior heating uniformity, which supports timed and temperature-controlled glue baking processes.

The maximum working temperature of ET-150 is 300°C (custom higher temperature options of 450°C and 500°C are available). After stable temperature regulation, the temperature fluctuation can be controlled within ±0.2°C with temperature resolution up to 0.1°C, and the surface temperature uniformity is better than 1% to realize high-precision temperature-controlled baking. Equipped with a built-in timer, it supports baking timing and timing alarm function.

1. Product Performance Parameters

1. Temperature Range: Ambient temperature ~ 350°C, adjustable temperature control

2. Temperature Resolution: 0.1℃ below 100°C; 1℃ above 100°C (Original Yudian PID digital display thermostat)

3. Temperature Fluctuation: ≤±1~2%℃

4. Temperature Uniformity: ≤±2% (9-point testing on worktop under maximum working temperature)

5. Time Resolution: 0.1S (Not available for standard in-stock version, customizable on request)

6. Heating Power: 600W

7. Heating Worktop Dimension: 150*150*20mm

8. Max Allowable Operating Temperature: 350℃

9. Overall Outer Dimension: 200(D) × 200(W) × 150mm(H)

2. Product Features

• Heating plate dimension: 220mm*220mm, compatible with wafer up to 8-inch size;
• Worktop optional: Hard anodized aluminum panel or Teflon-coated anti-corrosion non-stick panel;
• Independent heating circuit control for convenient heating start & stop operation;
• High-precision large-screen digital temperature controller; full stainless steel body for long service life;
• Adopts special thermal insulation design plus long-life heating elements with outstanding heating uniformity;
• Built-in digital display timer for convenient baking timing management;
• Integrated buzzer alarm to send alert once preset time is reached;
• Comes with thermal radiation protective cover to further improve baking uniformity;
• Shorter required baking cycle;
• Excellent process repeatability;
• Superior curing performance for thin films.

3. Main Application & Purpose

This wafer glue baking machine is mainly applied in photolithography processes for soft bake after spin coating, post-exposure baking, hard bake after development, as well as wax melting for wafer dicing and die bonding.