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ET Series Hot Plates are widely used for film drying and curing after surface coating in processes involving semiconductor wafers, glass slides, chips, substrates, ITO conductive glass, and plate making. The hot plates feature high temperature stability and excellent repeatability, suitable for production, R&D, and teaching applications in industrial and mining enterprises, research institutes, and educational institutions.
I. Performance Specifications
| Model | Specifications |
|---|---|
| ET-200 Hot Plate | 1. Temperature Range: Room Temp ~ 400℃, continuously adjustable 2. Temp Stability: ±0.5℃ 3. Temp Uniformity: ±3% (at max temp) 4. Timer: 0 ~ 999 mins (0 = continuous operation) 5. Power: Single-phase 110-240V 6. Heater Size: 200×200mm 7. Dimensions: 210×220×160mm 8. Weight: 6.5KG |
| Upgraded Version (with protective cover) | 1. Temperature Range: Room Temp ~ 500℃, continuously adjustable 2. Temp Stability: ±0.5℃ 3. Temp Uniformity: ±3% (at max temp) 4. Timer: 0 ~ 999 mins (0 = continuous operation) 5. Power: Single-phase 110-240V 6. Heater Size: 200×200mm 7. Dimensions: 210×220×160mm 8. Weight: 6.5KG |
II. Key Features
- Heating plate diameter 170mm, suitable for max 6″” wafer baking.
- Manual vacuum adsorption ensures close contact between substrate and heating plate.
- High-precision digital temperature controller supports step linear programmable temperature control.
- Full anodized aluminum body, elegant and durable.
- Independent heating circuit control for easy start/stop.
- Special heat insulation design and long-life, high-uniformity heating elements.
- Equipped with thermal radiation protection cover and microcrystal insulation panel for better temperature uniformity.
- Excellent stability with temperature accuracy up to ±0.5℃.
- Wide temperature range: Room Temp ~ 500℃.
- Closed-loop control system with fast heating speed.
- Built-in timer with countdown display function.
- Digital buttons for precise temperature and time setting.
- All-stainless steel body, acid, alkali and corrosion resistant.
- Customizable heating plate sizes available for different substrates.
III. Product Structure Diagram
Hot Plate Structure Diagram
IV. Packing List
| Item | Unit | Quantity |
|---|---|---|
| Hot Plate Main Unit | Unit | 1 |
| Power Cord | Set | 1 |
| User Manual | Copy | 1 |
| Quality Inspection Report | Copy | 1 |
| Certificate of Conformity | Copy | 1 |
| Warranty Card | Copy | 1 |
Note: Please check all accessories and documents according to the packing list.
