Intelligent programmable high-temperature photoresist bake hot plate delivers shortened baking cycles, superior process repeatability and optimal thin-film curing performance with fully automatic operation. Lithography and related technologies constitute core processes for Micro-Electro-Mechanical System (MEMS) fabrication. Spin coating and post-coat baking are indispensable lithography steps, which strengthen adhesion between photoresist layers and silicon wafers, optimize contact performance between resist films and photomasks during contact exposure, and stabilize the photosensitive sensitivity of resist coatings. The high-temperature programmable bake hot plate is a laboratory instrument engineered for programmed temperature ramping, precise timing and proximity heating, enabling fully intelligent recipe-controlled photoresist curing.

This bake hot plate features rapid temperature ramp speed regulated by PID digital temperature controller, paired with long-life heating elements with outstanding thermal uniformity. The working surface is a high-hardness aerospace-grade 7075 aluminum panel with hard anodized anti-corrosion treatment.

Intelligent and programmable high-temperature bake stations are widely used for post-coat thin-film drying and curing on semiconductor silicon wafers, glass slides, chips, substrates, ITO conductive glass and other patterned workpieces. It maintains outstanding temperature stability and process repeatability, suitable for production, research and teaching applications in industrial enterprises, scientific research institutes and educational institutions.

1. 1. Hard anodized aluminum plate with 220mm × 220mm surface, compatible with maximum 8-inch wafer substrates
2. 2. Adjustable temperature range: Ambient ~ 300℃, temperature resolution: 0.1℃
3. 3. 7-inch full-color touchscreen with advanced PLC control, temperature control accuracy up to ±0.2℃
4. 4. Proximity baking mode with motorized lifting pins; adjustable lifting stroke 0–30mm, lift height resolution 0.1mm
5. 5. Lift pins support round or square substrates with diameter / inscribed circle diameter over 40mm
6. 6. 1.5kW cast aluminum heating assembly for superior uniform heat distribution across the platen

1. 1. Heating surface dimension: 220 × 220mm, fits 200mm (8-inch) round wafers or square substrates ≤ 200×200mm; custom sizes available
2. 2. Optional temperature range: RT ~ 200℃ / 300℃ / 400℃ / 500℃ / 600℃ / 800℃
3. 3. Temperature resolution: 0.1℃
4. 4. Surface temperature uniformity: ≤ ±1%
5. 5. Motorized lift pin stroke: 0–60mm adjustable, height resolution 0.1mm; supports substrates over 40mm with proximity baking function
6. 6. Heating plate surface material: Hard anodized aluminum alloy
7. 7. Heating chamber cover material: SUS304 stainless steel
8. 8. Main cabinet housing material: SUS304 stainless steel
9. 9. Control unit: 7-inch full-color touchscreen + advanced PLC; automatic lifting/retracting within programmed timing cycles for timed wafer unloading
10. 10. Input power supply: AC220V 50Hz
11. 11. Rated power: 1500W, cast aluminum uniform heating core
12. 12. Auxiliary configurations: Built-in vacuum pump, vacuum wafer adsorption, 4 sets of limit position sensors
13. 13. Overall outer dimension: Width 303 × Depth 446 × Height 295 mm

Identical core technical parameters as integrated models, featuring split embedded mechanical design:

1. 1. Split structure: Heating main unit separated from control box, connected via signal cable
2. 2. Supports embedded installation under glove boxes or workbenches to lower overall operating height