The ET-300 photoresist bake hot plate adopts advanced digital heating design for precise surface temperature control. The robust corrosion-resistant aluminum alloy panel provides excellent thermal conductivity to fit multiple application scenarios. The digital display enables quick parameter setting and accurate temperature regulation. An independent overheat protection circuit guarantees safe experimental operation.

ET-300 Photoresist Bake Hot Plate

1. Product Features

High-precision microprocessor for superior temperature accuracy.
Dual display for set temperature and actual measured temperature; maximum working temperature up to 325℃.
Compact slim body with only 87mm height, perfectly suitable for installation inside glove boxes.
Simple and highly reliable structure; all electronic components are treated with anti-corrosion coating.
Separated layout of heating elements and control parts to improve operational safety.

2. Technical Specifications

Item	Parameter
Temperature Range	Ambient ~ 325℃ (Optional 500℃ / 700℃)
Heating Panel Size	160 × 160 mm
Plate Material	Aluminum Alloy
Control Mode	PID Closed-loop Control
Temperature Uniformity	≤ ±2%
Temperature Stability	±0.2℃
Temperature Control Accuracy	±0.2℃
Heating Power	700W
Net Weight	4.5 Kg
Overall Dimension (W×D×H)	250 × 180 × 87 mm

3. Application Range

Solar cell manufacturing
Microfluidic chip preparation
Photolithography process
Semiconductor fabrication process

We also supply high-end bake plates with lifting mechanism, vacuum adsorption and linear temperature programming. Please contact us for detailed quotations.

ET-300 Precision Photoresist Bake Hot Plate | Semiconductor Lithography Heating Platform