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HIGH TEMP HOT PLATE/

High Temperature Bake Hot Plate

This 600℃ high-temperature photoresist bake hot plate adopts a split design separating the heating unit from the electrical control box, so that control components are kept away from high heat. The panel is made of ceramic-coated stainless steel without discoloration under high temperature. The housing is treated with stainless steel coating to resist oxidation and discoloration. The heating coil features long service life and outstanding temperature uniformity. 600℃ High Temperature Bake Hot Plate 1. Product Features & Specifications Multi-layer structural design to protect electronic control components from high temperature. Split body design to isolate control parts from heat sources. Ceramic-coated stainless steel panel, no discoloration at high temperature. Coated stainless steel housing, anti-oxidation and no color fading. High-precision digital temperature…

  • Product Details

This 600℃ high-temperature photoresist bake hot plate adopts a split design separating the heating unit from the electrical control box, so that control components are kept away from high heat. The panel is made of ceramic-coated stainless steel without discoloration under high temperature. The housing is treated with stainless steel coating to resist oxidation and discoloration. The heating coil features long service life and outstanding temperature uniformity.

600℃ High Temperature Bake Hot Plate

1. Product Features & Specifications

  1. Multi-layer structural design to protect electronic control components from high temperature.
  2. Split body design to isolate control parts from heat sources.
  3. Ceramic-coated stainless steel panel, no discoloration at high temperature.
  4. Coated stainless steel housing, anti-oxidation and no color fading.
  5. High-precision digital temperature controller with accuracy better than ±0.5℃.
  6. Temperature range: Ambient ~ 600℃.
  7. Surface temperature uniformity: less than ±2%.
  8. Heating plate size: 215 × 215 mm.
  9. Electrical rating: AC220V, 12A, 2.5kW.
  10. Independent circuit for heating output to improve operational safety.
  11. Touchscreen version supports linear programmable temperature control (Model ET-200TGT-CTM).

Please contact us for more detailed information about ET-200TG high-temperature bake hot plate.Wafer-Bake-Hot-Plate

2. Application & Product Overview

This bake hot plate is mainly used for soft baking after spin coating, post-exposure baking, hardening after development, and wax melting for wafer bonding in photolithography processes. It is suitable for silicon wafers, glass slides, chips, substrates, ITO conductive glass and other materials for thin-film drying and curing after surface coating. The hot plate provides excellent temperature stability and repeatability for production, scientific research and teaching in factories, universities and research institutes.

This equipment delivers high thermal uniformity and precise temperature control. It features simple mechanical structure and fast heating speed. Equipped with a high-performance digital thermostat and long-life heating elements, it adopts hard corrosion-resistant anodized aluminum panel. It is widely used in laboratories requiring strict temperature accuracy and good thermal homogeneity.

3. Operation Procedures

  1. Switch on the power supply and turn on the main switch.
  2. Set target baking temperature using the up and down arrow keys on the temperature controller.
  3. Start the baking process after the plate reaches the preset temperature.
  4. Place samples or workpieces on the heating panel.
  5. In case of power fluctuation and abnormal display, shut down the unit immediately. Restart only after stable power is restored.
  6. glass top electric hot plateCut off power after use and cover the plate with a dustproof cloth.

ET-200TG High Temperature Bake Hot Plate | 600℃ Photoresist Curing Heating Platform

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