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IC Bonding & Chip Binding
Suitable for COG bonding and rework of LCD driver ICs, fingerprint chips and CMOS camera chips. Precise constant temperature preheating fully activates ACF conductive adhesive to stabilize chip lamination, effectively solving virtual connection and poor conduction problems with traceless rework and no component damage. 
Case 1: Preheating Lamination for COG Chip Bonding
Application Scenario:
ACF conductive adhesive requires specific temperature activation for COG bonding of LCD driver and fingerprint chips. Insufficient temperature causes poor conduction, virtual connection and line breakage.
Practical Solution:
Maintain the heating platform at a constant 110℃ to preheat glass substrates and chips as a whole, fully activating ACF conductive adhesive to improve conductivity and adhesion. Laminated chips achieve stable line conduction without virtual connection or breakage, greatly improving bonding accuracy and yield.
Case 2: Rework for CMOS Camera Chip Bonding
Application Scenario:
Virtual bonding of CMOS image chips on mobile phones and monitoring cameras causes blurry images and screen flickering. Disassembly and rework easily scratch lenses and damage chip pixels.
Practical Solution:
Use a precision small heating platform at a constant 90℃ to gently soften ACF adhesive for traceless chip disassembly. Re-align and bond the chip without scratching the lens module or damaging pixels, ensuring clear imaging and high rework stability.
