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Heating Plate Applications in LED and Optics Industry
Precise constant temperature heating runs through the full production process of LED lighting, backlight display and precision optical components. Our heating plates are applied to core processes including chip bonding, optical lens forming, lens coating curing and LED packaging baking. With ultra-uniform temperature field, low temperature difference, dust-free clean grade and stable temperature rising performance, they perfectly match COB, Mini/Micro LED, glass & acrylic optical lenses, automotive camera lenses and precision prisms, effectively improving bonding strength, forming consistency, light transmittance and finished product yield.
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COB Mini LED Chip Bonding Heating Plate
Working Condition: Mini LED die attach, silver adhesive & insulation glue curing for mass COB light board packaging
Configuration: 450×350mm aluminum alloy plate, temperature 80–150℃, uniformity ±0.5℃, Class 1000 anti-static clean surface
Application Results: Fully bubble-free glue curing, chip shear strength increased by 18%; color difference defect rate reduced from 7.2% to 1.1%
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Acrylic Optical Lens Hot Bending Heating Station
Working Condition: Thermal shaping for TV backlight lenses and automotive acrylic lenses, releasing internal injection stress
Configuration: 600×500mm thick cast aluminum heating plate, 120–180℃, uniformity ±0.8℃, hard anodized wear-resistant surface
Application Results: Lens warpage controlled below 0.03mm, light transmittance stably ≥92%; distorted optical surface reject rate decreased by 75%
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Camera Lens Coating Primer Curing Heating Plate
 Working Condition: Constant temperature baking and curing for base coating and anti-fouling coating of mobile & automotive glass camera lenses
Configuration: Φ280mm high-purity ceramic heating plate, 60–120℃, precision ±0.3℃, low outgassing for optical cleanroom
Application Results: Firm coating adhesion without peeling under high-low temperature cycles; camera module production yield increased by 9%
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LED Phosphor Glue Segmented Baking Heating Platform
Working Condition: Step temperature baking for SMD and high-power LED phosphor glue, preventing phosphor sediment and color temperature deviation
Configuration: 500×500mm multi-zone temperature control aluminum plate, staged heating 60℃→90℃→120℃, overall plate uniformity ±0.6℃
Application Results: Uniform phosphor dispersion, CCT deviation limited within ±200K; luminous efficiency raised by 6%, long-term light decay reduced
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