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Heating Plate Applications in PCB & FPC Industry
Precise constant temperature heating is indispensable for the full manufacturing workflow of rigid PCB and flexible FPC circuit boards. Our heating plates are widely used in copper foil lamination, solder mask curing, anisotropic conductive film pressing, PI film baking and component reflow preheating. Featuring anti-static surface, ultra-even temperature field, small temperature deviation and stable heating curve, they effectively reduce board warpage, improve bonding adhesion, eliminate bubbles and voids, and boost finished circuit board yield and dimensional stability.
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Multilayer PCB Prepreg Lamination Heating Plate
Working Condition: Constant temperature hot pressing for prepreg bonding in 4–12 layer rigid PCB production, eliminate interlayer bubbles
Configuration: 700×500mm thick cast aluminum plate, 160–190℃, uniformity ±0.7℃, high flatness pressure-bearing surface
Application Results: Interlayer void defect rate dropped from 5.8% to 0.6%, PCB overall warpage controlled under 0.04mm
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FPC PI Cover Film Pre-Baking Heating Station
Working Condition: Pre-dehydration baking for polyimide cover film before hot pressing on flexible circuit boards
Configuration: 600×400mm anti-static alloy plate, 110–140℃, uniformity ±0.5℃, dust-free anodized finish
Application Results: No blistering after film lamination, FPC bending resistance improved by 22%, flexible layer peeling failures greatly reduced
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Solder Mask Ink Thermal Curing Heating Plate
Working Condition: Step baking curing for green solder mask ink on finished PCB circuit patterns
Configuration: Large-size 800×600mm multi-zone heating plate, staged 80℃→120℃→150℃, full plate uniformity ±0.6℃
Application Results: Fully hardened solder mask without pinholes, acid & scratch resistance enhanced, PCB surface reject rate cut by 68%
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FPC ACF Bonding Constant Temperature Heating Platform
Working Condition: Precision heating pressing for anisotropic conductive film bonding between FPC and LCD/COG chips
Configuration: Φ300mm high-precision ceramic heating plate, 130–160℃, control precision ±0.2℃, low thermal deformation
Application Results: Stable circuit resistance, open/short circuit rate below 0.4%, display module connection reliability greatly upgraded
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