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Heating Plate Applications in Advanced New Material Industry
Ultra-precise constant temperature heating is a core processing condition for advanced new material synthesis, composite curing, film forming and post-treatment. Our heating plates serve carbon fiber composite, graphene, ceramic matrix composite, PI high-performance film and bio-degradable new material production. Featuring ultra-flat surface, wide temperature range, excellent temperature uniformity, low outgassing and anti-corrosion performance, they stabilize material molecular structure, eliminate internal defects, enhance tensile strength, thermal stability and finished material consistency.
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Carbon Fiber Composite Prepreg Curing Heating Plate
Working Condition: Step constant temperature curing for carbon fiber epoxy prepreg used in aerospace and new energy vehicle structural parts
Configuration: 750×550mm cast aluminum alloy plate, staged 90℃→130℃→160℃, whole plate uniformity ±0.6℃, pressure-resistant flat surface
Application Results: Zero internal bubbles and delamination, composite tensile strength increased by 21%, structural part reject rate reduced from 6.8% to 0.9%
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Graphene Conductive Film Annealing Heating Station
Working Condition: High-temperature annealing to remove solvent and repair graphene lattice for flexible conductive heating film
Configuration: Φ320mm high-purity AlN ceramic plate, 200–450℃, precision ±0.2℃, low outgassing vacuum compatible surface
Application Results: Graphene sheet resistance uniformity improved 78%, film conductivity boosted by 25%, flexible bending service life extended greatly
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High-Temperature PI Polyimide Film Stretching & Curing Heating Plate
Working Condition: Thermal imidization baking for ultra-thin PI base film used in FPC and lithium battery separator
Configuration: 900×600mm multi-zone split heating plate, 180–320℃ segmented control, transverse uniformity ±0.5℃
Application Results: Film thickness deviation ≤0.003mm, thermal shrinkage rate below 0.4%, high-temperature resistance stability upgraded significantly
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Biodegradable PLA/PBAT Material Molding Stress Relief Platform
Working Condition: Low-temperature annealing to release injection molding residual stress for disposable biodegradable packaging parts
Configuration: 650×450mm anti-stick anodized aluminum plate, 45–95℃, full surface uniformity ±0.4℃, non-stick coating finish
Application Results: Product long-term storage warpage reduced by 85%, brittleness under low temperature weakened, finished packaging pass rate increased by 11%
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