Custom Heating Solutions & Hot Plate Products

Professional Industrial Heating Equipment Manufacturer Since 2008 | CE Certified | 24-Month Warranty

About QICEQUIP

Shenzhen Qichuang Intelligent Equipment Co., Ltd. (QICEQUIP), established in 2008, is a professional Chinese manufacturer with 20 years of experience in heating plates, glue baking machines, wafer heating plates, vacuum hot presses, vacuum bonding machines and other electronic equipment. We have complete R&D and production capabilities covering electrical design, software development, mechanical design, machining and equipment debugging.

We are committed to becoming a leading supplier of constant temperature heating plate equipment and automation solutions, providing comprehensive and multi-level services to customers worldwide. Our products are widely used in LED industry, electronics manufacturing, industrial, medical, research institutes and scientific laboratories. We offer customized services for integrated series, split series, 500°C high temperature series and 800°C non-metal series products, which are exported to Europe, America, Asia and other countries and regions.

• Product Advantages

Heating Plate Materials: T6 hard aluminum alloy, brass, stainless steel, high-conductivity ceramic
Temperature Controller: Yudian high-precision intelligent PID digital controller, 24-month warranty
Heating Elements: Stainless steel heating tubes with resistance wire, 2x longer service life than ordinary tubes
Housing Material: SUS304 stainless steel, superior corrosion resistance compared to iron paint or SUS201

Customization Types & Options

We provide personalized customization services based on your specific requirements. Submit your basic product requirements, and our engineers will prepare engineering drawings and quotations for you.

Customization Category	Available Options
Heating Equipment Types	Constant temperature hot plate, glue baking machine, wafer heating plate, vacuum hot press, high temperature heating plate, laboratory biochemical heating equipment, automatic hot plate, microscope heating plate, vacuum adsorption heating plate
Machine Formats	Desktop, bench-top, split, vertical, round, square, custom shapes
Temperature Ranges	Standard: Room temperature ~ 350°C High temperature: Room temperature ~ 450°C Ultra-high temperature: Room temperature ~ 500°C 600°C type: Room temperature ~ 600°C 800°C type: Room temperature ~ 800°C Vacuum 1000°C type: Room temperature ~ 1000°C
Heating Plate Materials	304/316/310 stainless steel, copper plate, aluminum alloy, high-conductivity ceramic, transparent glass
Heating Elements	Stainless steel heating tube, infrared heating tube, ITO glass heating film
Temperature Control Features	Touch screen, PID automatic control, heating/cooling rate control, LED digital display, temperature compensation, ±0.1℃ accuracy, one-key auto-tuning, constant temperature control
Technical Configurations	Custom voltage/power, phase-shift trigger, overcurrent protection, time controller, automatic on/off, preheating function, RS-485/232 communication, explosion-proof heater
Additional Functions	Automatic lifting, vacuum glue baking, flowing atmosphere, nitrogen filling, heating plate rotation, casters, heating plate leveling

For export requirements, automation supporting equipment and special technical requirements, please contact our sales engineers for customized solutions.

Complete Heating Plate Solutions for All Industries

We provide comprehensive heating solutions from standard constant temperature hot plates to high-precision customized heating systems, tailored for electronics manufacturing, optoelectronics, laboratory research, semiconductor packaging and more. Our core products adopt PID intelligent closed-loop control with K-type thermocouple temperature measurement, delivering precise temperature control from room temperature to 400°C with ±1℃ accuracy and ≤±2℃ plate uniformity. Perfect for BGA reballing, LED soldering, sample drying, PCB preheating and various industrial processes.

Core Technical Advantages

• Precision Temperature Control System

Adopts PID + fuzzy control algorithm for fast response and minimal temperature fluctuation
K-type thermocouple directly contacts the heating plate bottom for accurate, delay-free measurement
Supports PID parameter auto-tuning for one-click optimization of control performance

• Uniform Heating Technology

Three high-power nickel-chromium alloy heating tubes evenly arranged
Thickened aviation-grade aluminum alloy plate with high thermal conductivity
Heat flow simulation optimized design, max temperature difference ≤±2℃ at 300°C

• Comprehensive Safety Protection

Triple electrical insulation design, leakage current <0.5mA (CE compliant)
Three independent safety mechanisms: over-temperature, leakage, dry-burning protection
Multi-layer insulation cotton, chassis surface temperature ≤50℃ to prevent burns

• Durable Industrial Design

Whole machine constructed with 304 stainless steel
Heating tubes use vacuum brazing process, service life ≥30,000 hours
Modular structure design for easy maintenance and part replacement

Selected clients

Industry-Specific Customized Solutions

• Electronics Repair Industry

Recommended Model: ET-2020 Advanced Version

Customized Configuration

200×200mm Heating Plate
Timer + Exhaust System
BGA Reballing Templates
High-Temperature Pads

Process Parameters

Lead-free solder: 240~260°C, 30~60s
Leaded solder: 220~240°C, 20~40s

Applications

Mobile phone CPU/baseband rework, laptop GPU BGA reballing

• Optoelectronics Industry

Recommended Model: ET-4030 Zone Control Type

Customized Configuration

400×300mm Large Plate
Dual-Zone Independent Control
LED Fixtures (Optional)

Process Parameters

SMD LED soldering: 230~250°C, 15~30s
COB packaging: 260~280°C, 40~60s

Applications

LED bulbs, street lamps, display module soldering

• Laboratory Research Industry

Recommended Model: ET-2020 Precision Type

Customized Configuration

PT100 Platinum Resistance
±0.1℃ Control Accuracy
Microcrystalline Glass Panel
10 Heating Curves

Process Parameters

Sample drying: 60~120°C, 1~24 hours
Heat treatment: 150~350°C, 1~10℃/min

Applications

Chemical digestion, material testing, biological reactions

• Semiconductor Packaging Industry

Recommended Model: Custom Wafer Heating Plate

Customized Configuration

4~12 Inch Round Plate
Class 1000 Cleanliness
Multi-Point Sensing
Vacuum Adsorption

Process Parameters

Wafer bonding: 300~350°C, ±0.3℃ accuracy
Aging test: 85~150°C, 1000 hours continuous

Applications

Wafer-level packaging, chip aging, MEMS manufacturing

Get Your Custom Heating Solution Today

Contact our engineering team for a free quotation and technical consultation. We provide OEM/ODM services for all special requirements.

📧 Email: info@hotplates.cn

📱 WhatsApp: +86-137-1472-0278

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Custom Heating Solutions & Hot Plate Products

Custom Heating Solutions & Hot Plate Products