The bake plate, also known as hot plate, is independently developed by Shenzhen Bangqi Chuangyuan Technology Co., Ltd. with independent intellectual property rights. It can be applied to soft bake, intermediate bake and post bake in photolithography processes. Equipped with a PID temperature control system for automatic temperature measurement and regulation, the equipment supports two-stage automatic temperature rise. It features fast and uniform baking speed and high temperature control precision, and is capable of long-term continuous stable operation. Many users have questions about parameter setting during operation. As a professional heating plate manufacturer, ETOOL provides professional operation guidelines for the bake plate below.

Bake Plate Operation Manual

(1) Power On: Connect the power supply and turn on the power switch on the rear panel. The touch screen lights up and enters the temperature display interface; the hot plate enters standby mode.

(2) Temperature Setting: Tap “Parameter Setting” on the touch screen to enter the setting page. Configure the temperature and holding duration for the first stage and second stage respectively.

(3) Start Operation: Return to the temperature display interface via touch screen and tap Start. The hot plate begins heating according to preset parameters. Real-time temperature curve can be monitored. When the difference between current temperature and target temperature is within 1℃, the system starts counting the remaining holding time of this stage.

(4) Stop Heating: Press the Stop button. The cooling fan will activate, the hot plate stops heating and enters cooling mode.

(5) Cooling & Shutdown: After baking, the plate remains at high temperature. Keep the power connected for a period to allow natural cooling. Avoid powering off under high temperature, which may cause internal equipment damage or scald accidents. Turn off the power switch and unplug the power cord only when the temperature drops below 50℃.

Safety Precautions

After unpacking, check all accessories carefully against the packing list. Contact your distributor if any items are missing. Remove all packaging materials and foam pads completely. Residual packaging may block heat dissipation and potentially cause fire hazards.

Read the full operation manual thoroughly before operation and strictly follow the procedures. The manufacturer shall not be liable for personal injury, equipment damage or property loss caused by irregular or improper operation.

Usage Notes

(1) Place the equipment on a firm and flat workbench. Ensure four rubber feet make full contact with the surface. Instable placement will affect wafer baking uniformity.

(2) Do not lean against the equipment during operation. Unauthorized personnel shall not stay within the high-risk area to prevent scalding.

(3) Always use tweezers to load and unload wafers to avoid high-temperature burns.

(4) Cut off power supply immediately in case of malfunction and contact your distributor or manufacturer. Do not open the machine housing by yourself. Maintenance must be performed by qualified technicians with power disconnected to prevent safety accidents.