Heating Plate Applications in Integrated Circuit & Semiconductor Industry
High-precision constant temperature heating runs through the entire IC semiconductor manufacturing workflow. Our heating plates serve wafer fabrication, chip annealing, packaging curing and device reliability testing. Featuring ultra-even temperature field, vacuum & high temperature resistance, Class 100 high cleanliness and high temperature accuracy, they satisfy strict standards for photolithography, dehydration, annealing and encapsulation curing, stably boosting chip electrical performance and mass production yield.
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12-inch Wafer Drying Heating Plate After RCA Cleaning
Working Condition: Dehydration bake for 12-inch silicon wafers post RCA cleaning, control moisture ≤0.02% to avoid photoresist pinholes and wafer warpage
Configuration: 600×400mm AlN ceramic plate, constant 120℃, ±2.5℃ uniformity, Class 100 clean grade
Application Results: Moisture reduced ≤0.015%, pinhole rate 8%→1%, overall wafer yield increased by 12%
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300mm ALD Vacuum AlN Ceramic Heating Plate
Working Condition: Thin film deposition for 300mm logic wafers under 10⁻³~10⁻⁶Pa high vacuum, ultra-uniform heating required
Configuration: High-purity AlN ceramic, 200–500℃, ±0.1℃ precision, ±0.3℃ uniformity, low outgassing & corrosion resistant
Application Results: Film thickness 3σ deviation 0.8%→0.3%, particle contamination <1 piece/100cm²
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Multi-Zone RTP Rapid Thermal Annealing Heating Station
Working Condition: Post ion implantation annealing for 8/12-inch IC wafers, activate dopants and repair lattice defects
Configuration: Multi-zone ceramic plate, 400–1100℃, heating rate 5–50℃/s, compatible with nitrogen inert gas
Application Results: Uniform doping activation, sheet resistance deviation <2%; annealing time cut 60%, production capacity improved
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QFN/BGA IC Packaging Epoxy Vacuum Curing Plate
Working Condition: Epoxy molding compound curing for automotive & consumer QFN/BGA packaged IC chips
Configuration: 500×500mm stainless steel vacuum plate, stable 100–150℃, vacuum environment support
Application Results: Void-free full curing, higher package strength; IC passes high temp & humidity aging reliability test
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