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The ET-200 High Precision Programmable Hot Plate is a high-performance laboratory instrument designed for precise temperature control, accurate timing, and proximity heating. It enables intelligent programmable baking control.
The maximum baking temperature of the ET-200 is 300℃ (higher temperatures are optional). It delivers precise temperature control with an accuracy of ±0.5℃, a temperature resolution of 0.1℃, and surface temperature uniformity of less than 1%. The ET-200 features a lifting function for proximity-mode baking, supporting precise timing and easy sample loading and unloading. The lifting system supports 5-step programming and can store up to 100 groups of lifting baking programs.
Product Features
- Heating plate area: 220mm × 220mm, suitable for wafers up to 8 inches
- Corrosion-resistant hard anodized aluminum panel
- Built-in lifting function for proximity heating and baking
- Programmable precise timing, accurate temperature control, and adjustable lifting height
- 7-inch full-color touch screen operation; all-stainless steel body for durability
- Special heat insulation design and long-life, high-uniformity heating components
- Editable and storable: 100 groups of programs, 5 steps per group
- Equipped with thermal radiation protection cover for improved baking uniformity
- Lifting function supports substrates larger than 40mm in diameter; customizable for special requirements
- Linear temperature control and vacuum adsorption available (ET-200-XF)
Technical Specifications
| Maximum Set Temperature | 300℃ |
| Temperature Resolution | 0.1℃ |
| Maximum Set Time | 100,000 S |
| Time Resolution | 0.1 S |
| Lifting Adjustment Distance | 30 mm |
| Lifting Resolution | 0.1 mm |
| Heating Power | 1000 W |
| Net Weight | 25 Kg |
| External Dimensions | 450(D) × 300(W) × 295(H) mm |
ET Series Hot Plates
For detailed information and inquiries about the ET-200 Programmable Lifting Hot Plate, please contact us at any time.
