Our digital precision large uniform-temperature hot plate is independently developed by our company. It adopts imported temperature control systems and premium heating materials to deliver high-performance constant-temperature platforms. It meets stringent customer requirements for surface flatness, temperature uniformity, durability and long-term reliability. Custom heating surface dimensions are available upon request; customers can select standard PID temperature control or multi-segment programmable temperature control systems according to process demands.

The constant temperature hot plate uses a closed-loop PID temperature control system for automatic temperature measurement and regulation. It features fast photoresist baking speed, excellent temperature uniformity and high control precision, supporting long-term stable continuous operation.

It is designed for pre-bake, post-bake and hard bake procedures in photolithography processes. This equipment delivers fast baking speed, superior temperature uniformity, precise thermal control and highly repeatable experimental results. Dedicated baking programs cover pre-bake, post-exposure bake and hard bake workflows for photolithography manufacturing.

It serves as an ideal processing tool for depositing metal oxide thin films, polymer coatings and metal-organic thin films on silicon wafers and other substrates. Compared with traditional convection ovens, thin film curing on hot plates shortens baking cycle, improves process repeatability and produces more uniform, high-quality thin film layers. It provides homogeneous bottom-up heating for films and coatings, effectively eliminating the skin effect caused by top-down heating inside ovens.

Also known as photoresist baking platform, heating stage, thermal plate, etc. Typical applications include soft bake after photoresist coating, post-exposure bake, hard bake after development, wafer lapping, die bonding and wax melting in photolithography processes. The unit adopts a one-piece cast heating block as heating medium to enhance equipment safety. Controlled by single-chip microcomputer core with ultra-high temperature control accuracy, compact and elegant structure. Especially suitable for heating and clamping temperature-sensitive materials such as crystals, semiconductors and ceramics. Simple structure, easy operation, safe and reliable, widely used for semiconductor thermal treatment, material research production and thermal drying testing.

1. Dual real-time display for set target temperature and actual measured temperature simultaneously.
2. Integral cast aluminum alloy heating surface with outstanding thermal conductivity, zero permanent deformation under long-term high-temperature heating.
3. Full stainless steel outer cabinet housing.
4. High-precision microcomputer PID automatic temperature regulation with clear LED digital readout.
5. Temperature control range: Ambient ~ 300℃ with excellent surface temperature uniformity.
6. Built-in temperature calibration function to guarantee consistency between displayed value and actual surface temperature.

1. Temperature range: Ambient ~ 300°C
2. Temperature resolution: 0.1°C
3. Temperature fluctuation: ≤±0.1°C
4. Surface temperature uniformity: ≤±2% of full scale reading
5. Heating plate dimension: Fully customizable according to customer drawings
6. Rated power: 3500W (standard configuration)
7. Temperature control mode: Intelligent PID closed-loop control
8. Cabinet material: SUS304ステンレス

The solid heating medium is placed on the heating surface of the base plate. Heating tubes generate heat and transfer thermal energy to the base plate, then evenly conduct heat to the solid workpiece via full surface contact. Complete surface-to-surface contact between heating tube & base plate, and workpiece & base plate maximizes contact area, significantly improving heating speed and temperature uniformity across the entire working surface.

Laboratory heating plates are cost-effective, simple and elegant lab instruments that satisfy most routine heating demands. Developed for small-scale lab chemical processing including sample digestion, boiling, acid evaporation and thermal pretreatment. Widely deployed in labs of industrial & mining enterprises, medical institutions, environmental monitoring, biochemistry and scientific research institutes for chemical analysis, physical measurement, thermal treatment, sample baking, drying and various thermal stability tests.

1. Check all wiring terminals for secure connection;
2. Connect mains power and turn on the main power switch;
3. Press temperature setting button to input target process temperature;
4. The hot plate initiates heating automatically until digital display matches preset temperature;
5. After experiment completes, cut off power and allow the hot plate to cool naturally down to ambient temperature before cleaning or storage.

1. The contact surface where heating elements are mounted must be flat without bumps or indentations.
2. Store heating elements in dry environment; avoid liquid immersion which will damage insulation performance.
3. Before installation, verify mounting dimension matches heater specification and rated supply voltage is consistent with equipment label.
4. After full installation, retighten hex socket bolts, terminal block screws and cable connection screws to prevent loosening caused by thermal expansion & contraction that shortens service life.
5. Operate only under fixed rated supply voltage.
6. Unplug power cord if equipment will remain idle for long periods; store hot plate in dry environment covered with plastic dust-proof sleeve.

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