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BGA Ball Mounting, Desoldering & Packaging
Used for desoldering, ball mounting and pre-tinning pretreatment of BGA chips on computer and server motherboards. Stepwise temperature rise and constant temperature tin melting ensure uniform solder balls without short circuit, avoiding damage to chips and PCBs, and improving the accuracy and success rate of chip packaging and rework.
Case 1: Ball Mounting & Rework for Motherboard BGA Chips
Application Scenario:
Falling balls, virtual welding and short circuit of CPU and video memory BGA chips on laptops and server motherboards cause equipment crash and startup failure.
Practical Solution:
Preheat the motherboard bottom at 130℃ to balance the overall temperature and release board stress. Perform BGA ball mounting with steel mesh tin scraping, then heat to 240℃ for constant temperature tin melting. The formed solder balls are uniform and regular without bridging or virtual welding, ensuring high rework stability.
Case 2: Pre-Tinning for New BGA Chip Packaging Pads
Application Scenario:
Original bare BGA chip pads are tin-free and slightly oxidized, easily causing virtual welding and poor contact after direct mounting, requiring pretreatment tinning.
Practical Solution:
Adopt stepwise heating: preheat at 150℃ to remove pad moisture and oxide layers, then heat to 235℃ for constant temperature tin melting to achieve uniform and full tin wetting on BGA pads. Preprocessed chips complete PCB mounting and welding successfully at one time with stable conduction.
