High-temperature photoresist bake hot plate with high precision temperature control and excellent thermal uniformity. This vacuum and nitrogen purging hot plate adopts nitrided 310S stainless steel panel which will not discolor under continuous high temperature. The multi-layer insulation structure protects electronic components effectively. Anti-scald guardrails around the panel reduce safety risks. The lid is equipped with an observation window to monitor samples in real time during experiments. It is used for heating processes of semiconductor wafers, ITO conductive glass, optical glass, biological thin films and photolithography plates. It supports vacuum adsorption and positioning functions, and custom dimensions and functions are available on request.
High Temperature Photoresist Bake Hot Plate
1. Key Features
- Panel: Nitrided 310S stainless steel with no discoloration at high temperature; optional hard corrosion-resistant anodized aluminum surface.
- High-precision digital thermostat with multi-segment linear programming. Heating ramp rate is adjustable; multi-step temperature profiles can be edited freely.
- Dual display for set value and actual reading; standard max temperature 400℃, customizable up to 600℃ or 800℃.
- Multi-layer heat insulation structure to fully protect internal electrical components.
- Independent heating circuit for improved safety; separated layout of heating elements and control parts.
- Surrounding anti-scald fences to prevent burn accidents.
- Manual on/off vacuum adsorption to ensure tight contact between substrate and heating surface.
- Long-life heating cartridge with superior homogeneity and optimized thermal insulation structure.
- Recessed heating structure with compact footprint, suitable for installation inside glove boxes.
- Vacuum performance: 10⁻¹ Pa with mechanical pump; 10⁻³ Pa with turbomolecular pump.
2. Technical Specifications
| Item | Parameter |
|---|---|
| Heating Plate Size | Φ220mm (for 8-inch wafer) / 220×220mm |
| Temperature Range | Ambient~250℃ / 300℃ / 500℃ / 600℃ / 800℃ |
| Plate Material | Nitrided 310S Stainless Steel |
| Control Mode | Self-tuning PID |
| Temperature Resolution | 0.1℃ |
| Temperature Accuracy | ±0.2℃ |
| Temperature Uniformity | ≤±1% (9-point or 12-point test) |
| Vacuum Level | ≤-1Pa; double-stage rotary vane pump: -0.8Pa |
| Vacuum Chamber Dimension | 300(W)×300(D)×60(H) mm |
| Power Supply | AC220V, 8A |
| Heating Power | 1500W |
| Net Weight | 8kg |
3. Performance Introduction
This high-precision bake hot plate integrates precise temperature control, vacuum adsorption and excellent thermal uniformity for photoresist curing processes. Model HP6 has a maximum baking temperature of 200℃. After stabilization, temperature fluctuation is controlled within ±0.2℃ with 0.1℃ resolution and surface uniformity better than 1%. Multi-segment linear temperature programming is supported.
4. Operation Manual
- Power On: Connect power and turn on the rear main switch. The touchscreen lights up and enters temperature standby interface.
- Parameter Setting: Tap “Parameter Setting” on the touchscreen, then set temperature and holding time for Stage 1 and Stage 2.
- Start Program: Return to main display and press Start. The hot plate begins heating in accordance with the programmed curve. When current temperature is within 1℃ of the set value, the timer starts counting the holding period.
- Stop Heating: Press Stop. The cooling fan turns on immediately, and heating stops for forced cooling.
- Shutdown Procedure: Keep the power supply connected to continue cooling after baking. Do not cut power abruptly while the plate is still hot, which may damage internal components or cause scalds. Cut off power and unplug the cord only after the temperature drops below 50℃.
