This flat desoldering heating plate adopts high-performance microprocessor chip for control circuit, featuring precise temperature regulation, intuitive digital display, strong practicality and automatic heating element fault diagnosis. The heating plate is manufactured from premium aluminum alloy, delivering fast temperature rise, high thermal efficiency, uniform heat distribution and easy temperature adjustment.
Flat Desoldering & Soldering Heating Plate
1. Application Range
- Electronic component heating & soldering
- SMD component rework & replacement
- PCB board desoldering and soldering operations
- Heating for physical & chemical lab containers
- Heating auxiliary for other equipment and fixtures
2. Basic Technical Parameters
- Power Supply: AC220V 50Hz
- Temperature Range: Standard model (Ambient ~ 350℃); High temp model (Ambient ~ 450℃); Optional 500℃ model & 850℃ non-metallic high thermal conductivity ceramic model
- Temperature Control Accuracy: ±1%
- Structure Type: Integrated type (height 150mm); Split type (heating plate height 20mm, overall height 65mm)
3. Integrated Model Size Specifications
| Model | Heating Plate Size (mm) | Max Power | Net Weight |
|---|---|---|---|
| ET-50 | 50×50×150 ±1 | 80W | 3.1Kg |
| ET-70 | 70×70×150 ±1 | 260W | 3.3Kg |
| ET-100 | 100×100×150 ±1 | 400W | 3.5Kg |
| ET-1510 | 150×100×150 ±1 | 500W | 3.8Kg |
| ET-150 | 150×150×150 ±1 | 500W | 4.2Kg |
| ET-200 | 200×200×150 ±1 | 800W | 4.5Kg |
| ET-3020 | 300×200×150 ±1 | 1200W | 6Kg |
| ET-360 | 360×250×150 ±1 | 1500W | 7.5Kg |
| ET-400 | 400×300×150 ±1 | 2400W | 10Kg |
| ET-600 | 600×400×150 ±1 | 3200W | 20Kg |
The above dimensions apply to integrated models only. All split-type heating plates have a thickness of 20mm. Standard sizes are in stock; non-standard custom orders take 2–5 working days with separate quotation.
4. Product Highlights
- CPU closed-loop temperature control for accurate, stable thermal output
- Easy installation of heating coils
- Dual temperature setting modes: standard preset & real-time quick adjustment
- Clear, accurate digital temperature readout
- Automatic temperature sensor fault detection function
- Premium solid aluminum plate with high heat efficiency and uniform temperature distribution
5. Temperature Setting Instructions
Standard Temperature Preset: Long press the * key for more than 1 second to enter setting mode. Short press the * key to switch digit positions, then adjust values via up/down temperature keys.
Real-Time Quick Adjustment: While the plate maintains constant temperature, directly press up/down keys to adjust current working temperature within ±50℃ range.
6. Safety Precautions
- Place the unit on a flat, heat-resistant workbench.
- The plate surface and surrounding area become extremely hot during operation; operate carefully to avoid burns.
- Monitor heated components closely; excessive temperature may damage electronic parts.
- Do not operate near flammable or combustible materials.
- Cut off power and wait until the plate fully cools to room temperature before moving or touching the machine.
- Disconnect power when not in use to prevent safety hazards.
- To extend service life, avoid continuous operation above 300℃ for long periods; maximum continuous working time shall not exceed 8 hours.
- Guarantee reliable grounding connection of the equipment.
- Avoid direct airflow blowing onto the plate surface, which will interfere with temperature uniformity.
7. Soldering Process for LED Heat Sink (Copper Substrate + Aluminum Base)
- Step 1: Apply solder paste on the surface of aluminum base.
- Step 2: Remove residues on nickel-plated aluminum base, then spread a uniform layer of chlorine-free lead-free solder paste on nickel coating; apply solder paste on copper substrate.
- Step 3: Clean copper substrate surface and evenly coat chlorine-free lead-free solder paste on the cleaned area.
- Step 4: Attach the paste-coated sides of copper substrate and aluminum base together, place on constant temperature hot plate to heat until solder paste layers fuse completely.
- Step 5: Remove the assembled copper substrate & aluminum base component and cool down to room temperature.
