The high-temperature bake hot plate model ET-220 is designed with reliable temperature accuracy and excellent thermal uniformity. It is a practical benchtop unit equipped with a high-performance digital temperature controller, long-life heating elements, and hard corrosion-resistant anodized aluminum panel. It is ideal for laboratory processes requiring strict temperature precision and even heat distribution. Widely used in microelectronics, semiconductors, photolithography, new energy, biomaterials, coating, thin-film, optics and surface coating processes. Suitable for production, scientific research and teaching in industrial enterprises, research institutes and universities. Multiple specifications are available at competitive prices.
ET-220 Photoresist Bake Hot Plate
1. Technical Parameters
| Item | Parameter |
|---|---|
| Heating Panel Size | 220mm × 220mm |
| Temperature Range | Ambient ~ 400℃ (higher temperature optional) |
| Temperature Resolution | 0.1℃ |
| Temperature Control Accuracy | ±1℃ |
| Temperature Uniformity | < ±2% |
| Net Weight | 35kg |
| Power Supply | AC220V, 8A |
| Heating Power | 1500W |
| Overall Dimension (D×W×H) | 450 × 350 × 300 mm |
2. Basic Product Features
- Anodized aluminum heating panel
- High-precision digital temperature controller
- Independent heating circuit
- Long-life heating element with excellent thermal uniformity

3. Manufacturer Information
Shenzhen Bangqi Chuangyuan Technology is a high-tech enterprise specializing in the R&D and production of precision instruments and semiconductor equipment. We keep developing high-quality domestic instruments and strive to build an internationally renowned brand.
4. Working Principle & Key Advantages
The entire panel maintains even temperature distribution, which brings excellent curing results for thin films on substrates. Heat propagates upward from bottom to top without the skin effect. This inside-out curing mode is especially suitable for thick photoresist layers: the layer close to the substrate solidifies first, followed by the surface layer. Fast heating greatly improves throughput. The baking cycle is counted in seconds instead of minutes or hours like conventional ovens.
- Large heating area compatible with standard wafer sizes
- Hard anodized aluminum panel with corrosion resistance
- Pin lifting structure for proximity heating mode
- Programmable timing and precise temperature control with adjustable pin height
- Full-color touchscreen; all-stainless steel chassis for long service life
- Optimized thermal insulation and high-uniformity heating cartridge
- Storage for 5-step user-defined baking programs
- Thermal radiation cover to improve baking uniformity
- Custom pin layout to match substrate diameters
- Optional linear temperature ramp and vacuum adsorption functions

5. Equipment Structure
The unit mainly consists of cabinet, heating assembly and electrical control system. The cabinet includes main body, cover and lid. The heating unit is composed of heating plate, heating element, heat preservation and insulation layers. The electric control system includes temperature controller, relay, thermocouple, switches, indicator lamps, cooling fan and power socket. The controller, power switch and indicators are installed on the front panel. The cooling fan is mounted on the rear wall, and other electrical components are fixed on the bottom plate inside the cabinet.
6. Operation Procedures
- Connect the power supply and turn on the main switch.
- Set the target baking temperature using the up/down arrow keys on the temperature controller.
- Start processing after the plate stabilizes at the preset temperature.
- Place the wafer or sample on the heating plate; the operator controls the baking duration.

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