Benchtop wafer bake hot plate (photoresist curing hot stage) delivers uniform heating, short baking cycles and excellent repeatability. It consists of a vacuum chamber and a temperature control unit. Adopting advanced digital heating technology, it ensures consistent surface temperature. The rigid corrosion-resistant aluminum alloy panel offers outstanding thermal conductivity for multiple applications. Digital display enables fast parameter setting and precise temperature regulation. An independent overheat protection circuit guarantees experimental safety.

The HP6 high-precision compact bake hot plate is small enough to fit inside a glove box and supports processing up to 6-inch wafers. It features an innovative attractive structure with fully anodized aluminum housing. It heats up rapidly, controlled by a high-performance digital thermostat with long-life high-uniformity heating elements and hard corrosion-resistant anodized aluminum panel. Equipped with vacuum wafer chuck and thermal radiation sealed lid, it is ideal for laboratory processes requiring strict temperature accuracy and superior thermal homogeneity.

1. Hard anodized aluminum heating panel with high hardness and corrosion resistance.
2. High-precision digital controller with multi-segment linear temperature programming; adjustable heating ramp and editable multi-step thermal profiles.
3. Dual display for set temperature and real-time measured temperature; standard max temperature 400℃, customizable up to 600℃ or 800℃.
4. Independent heating circuit improves operational safety; heating parts and electronic components are structurally separated.
5. Manually controlled vacuum adsorption ensures tight contact between substrate and heating surface.
6. Long-life heating element with high thermal uniformity and optimized heat insulation structure.
7. Recessed heating structure with compact dimensions for glove box installation.
8. Thermal radiation sealed cover; maximum controlled temperature 250℃ with lid closed.
9. Superior temperature uniformity and high control precision.
10. Mini slim body specially designed for glove box environment.
11. Vacuum level: 10⁻¹ Pa with mechanical pump; 10⁻³ Pa with turbomolecular pump.
12. Customizable observation window and reserved electrical expansion ports.
13. Short baking cycle, excellent repeatability and perfect thin-film curing effect.

• Solar cell manufacturing
• Microfluidic chip fabrication
• Photolithography process
• Semiconductor manufacturing

It is used for thin-film drying and curing after spin coating on silicon wafers, glass slides, substrates and ITO conductive glass. It can be used for aging tests, temperature experiments, drying, baking and heat treatment for production, scientific research and teaching in industrial enterprises, universities and research institutes.

This bake hot plate provides precise temperature control and high thermal uniformity. It features simple structure, fast heating speed, digital thermostat, long-life heating elements and hard anodized aluminum panel, suitable for precision laboratory processes.

1. Connect power supply and turn on the main switch.
2. Set target baking temperature using the up and down arrow keys on the temperature controller.
3. Start baking after the heating plate reaches the preset temperature.
4. Place wafers or samples on the heating panel.
5. In case of sudden power fluctuation and abnormal display, shut down the machine immediately. Restart only after the power supply becomes stable.
6. Cut off power after use and cover the unit with dustproof cloth.

1. Temperature range: Ambient ~ 300℃ (Do not close the lid when temperature exceeds 150℃).
2. No corrosive substances in the surrounding environment.
3. No strong vibration and direct radiation from cold or heat sources.
4. Indoor laboratory working environment only.