Glue Dispensing & Curing Heating
Applicable to post-dispensing and potting curing of power supplies, sensors and electronic components. It precisely heats and accelerates the curing of epoxy glue, UV glue and other adhesives, solving the problems of slow natural curing and incomplete internal curing, improving bonding strength, waterproof and insulation performance, and doubling production capacity.
Case 1: Epoxy Resin Curing for Power Adapters
Application Scenario:
Epoxy insulation and waterproof potting inside switching power supplies and adapters suffers from slow natural curing, low efficiency and insufficient bonding strength due to incomplete curing.
Practical Solution:
Place potted power products on the heating platform and bake at a constant 80℃ for 1.5 hours to accelerate epoxy cross-linking and complete curing. The products meet standards in bonding strength, insulation and waterproof grade, with production capacity increased by 3 times, suitable for batch assembly line operation.
Case 2: Secondary Heating Curing for Sensor UV Glue
Application Scenario:
UV glue on temperature and pressure sensors only cures on the surface under ultraviolet irradiation, with uncured internal glue, easily causing cracking, degumming and water seepage during long-term use.
Practical Solution:
Insulate at a constant 65℃ for 20 minutes with a low-temperature heating platform to promote deep cross-linking and thorough curing of UV glue. The finished products resist high and low temperatures and aging, maintaining stable sealing performance without cracking or degumming for long-term use.
