The nitrogen-filled wafer bake machine is modified on the basis of standard ET-220 bake station, equipped with a sealed cover and nitrogen inlet port to deliver uniform nitrogen flow inside the chamber and form inert protective atmosphere. The programmable nitrogen purged bake machine is a high-precision thermal curing device integrated with lifting platform, vacuum adsorption and linear ramp temperature control functions.

Max baking temperature reaches 400℃ (higher temperature versions optional). Temperature control accuracy within ±0.5℃, temperature resolution 0.1℃, surface temperature uniformity less than 1%. Model ET-220-DQ is equipped with proximity-mode lifting function for timed baking and convenient wafer loading/unloading. The lifting motion supports 5-step programming, and up to 100 groups of complete lifting & baking recipes can be stored.

• Built-in vacuum adsorption: vacuum activates when pins approach the heating plate to prevent wafer sliding and ensure tight contact with hot surface
• Linear ramp temperature control: self-regulating heating output for linear temperature rise, ramp rate adjustable from 0.1~15℃/min, supporting up to 10 segmented temperature zones

• ● Heating plate area: 220mm × 220mm, compatible with maximum 8-inch wafers
• ● Optional platen: hard anodized aluminum plate or PTFE coated anti-corrosion non-stick plate
• ● Motorized lifting platform for proximity-mode low-contact baking process
• Programmable precise timing, high accuracy temperature regulation, adjustable lifting stroke height
• 7-inch full-color touchscreen operation, full SUS304 stainless steel cabinet for long service life
• Special multi-layer thermal insulation structure paired with long-life, high-uniformity heating elements
• Supports editing & storage of 100 user recipes, each recipe contains 5 lifting & heating steps
• Equipped with thermal radiation shielding cover to improve overall baking temperature uniformity

1. Nitrogen inlet pipe diameter: 15 mm
2. Max set temperature: 400 ℃
3. Temperature resolution: 0.1 ℃
4. Max programmable timing value: 100,000
5. Time resolution: 0.1 second
6. Total adjustable lifting travel: 30 mm
7. Lifting stroke resolution: 0.1 mm
8. Heating power: 1000 W
9. Net weight: 25 Kg
10. Overall dimension: Depth 450 × Width 300 × Height 295 mm

After unpacking, fully inspect all accessories against packing list; contact supplier immediately if any parts are missing. All foam and packaging cushions must be completely removed before operation, otherwise poor heat dissipation may cause fire hazards.

Read this full manual thoroughly before operation and follow all operating steps strictly. Manufacturer shall not be liable for personal injury, equipment damage or property loss caused by improper or unauthorized operation.

1. (1) Place the unit on a solid, flat workbench. Four rubber foot pads must fully contact the table surface; unstable placement will degrade wafer baking uniformity.
2. (2) Do not lean against the equipment during heating operation. Unauthorized personnel shall not stay within the safety clearance zone to avoid high-temperature scald injuries.
3. (3) Always use tweezers to load and unload wafers to prevent burns.
4. (4) Cut off power supply immediately if any fault occurs and contact supplier or factory service team. Do not disassemble cabinet by yourself. Only certified technicians may perform maintenance; always unplug power cord before any repair work to avoid electrical accidents.