High-end high-performance silicon wafer & chip photoresist bake hot plate, Brand: ETOOL. Core advantages of ETOOL programmable bake hot plate: program-controlled temperature curve, intuitive simple operation. With 15 years independent R&D experience dedicated to photoresist curing equipment, this thin-film bake hot plate delivers ultra-short baking cycles, excellent process repeatability and superior thin-film curing performance. Rapid temperature ramp-up significantly boosts throughput, with baking time measured in seconds instead of minutes or hours. Widely deployed in electronics, chemical industrial enterprises, scientific research institutes and educational institutions for thermal aging, temperature cycling tests, drying, baking, disinfection and general heat treatment experiments.

Heating elements are embedded inside the heating chuck, which is precision machined from solid aluminum block (copper block for 600℃ high-temperature models). This design achieves fast thermal conduction together with outstanding temperature uniformity. Equipped with intelligent temperature control system and premium thermal insulation structure, the unit maintains ultra-stable constant temperature and superior surface uniformity across the entire platen.

Temperature distribution across the full plate surface is highly uniform, delivering ideal curing results for thin films on substrates. Heat transfers upward from the bottom, eliminating the “skin effect” (surface skinning while inner film remains uncured). This inside-out curing mode is especially ideal for thick films: the layer adjacent to the substrate cures first, followed by outer film layers. Fast ramp speed drastically improves production throughput, with baking cycles counted in seconds rather than minutes/hours as with traditional box ovens.

1. 1. Greatly shortened baking cycle time
2. 2. Excellent process repeatability batch-to-batch
3. 3. Uniform, high-quality thin-film curing effect

1. 1. Temperature control range: Ambient ~ 300℃, fully adjustable
2. 2. Constant temperature fluctuation: ≤ ±2℃
3. 3. Surface temperature uniformity: ≤ ±3% (measured across full platen at maximum operating temperature)
4. 4. Cooling fan motor power: 11W
5. 5. Heating platen working size: 184 × 184 mm
6. 6. Overall instrument dimension: 210 × 262 × 256 mm
7. 7. Gross weight: 7 kg

1. (1) Power On: Connect mains power and toggle rear power switch; touchscreen illuminates and enters temperature display standby mode.
2. (2) Temperature Recipe Setup: Tap “Parameter Settings” on touchscreen to enter configuration page, set target temperature and hold duration for Stage 1 and Stage 2 respectively.
3. (3) Start Heating Cycle: Return to temperature display screen and tap Start button. The hot plate ramps to set temperature in real time with live temperature curve visualization. Timing countdown initiates automatically once actual temperature is within 1℃ of setpoint.
4. (4) Stop Heating: Tap Stop key to terminate heating; cooling fan activates and the unit enters natural cooling state.
5. (5) Cool Down & Power Off: After baking completes, the platen remains at high temperature. Keep power connected for cooling to avoid internal component damage and operator scald hazards. Disconnect power switch and unplug mains cable only after surface temperature drops below 50℃.

After unpacking, fully inspect all accessories against packing list; contact supplier immediately if any components are missing. All foam packaging and cushioning must be completely removed before operation; residual packaging material will block heat dissipation and may cause fire hazards.

Read the entire manual thoroughly before operation and strictly follow all operating sequences. Manufacturer accepts no liability for personal injury, equipment damage or property loss arising from improper or unauthorized operation.

1. (1) Install the instrument on a rigid, flat workbench. All four rubber foot pads must fully contact the table surface; unstable placement degrades silicon wafer baking uniformity.
2. (2) Do not lean against the equipment during heating operation. Unauthorized personnel must not stay within restricted safety zones to prevent high-temperature scald injuries.
3. (3) Always use tweezers to load and unload silicon wafers to avoid burns.
4. (4) Immediately cut off power supply upon equipment fault and contact authorized distributor or factory service team. Do not disassemble cabinet housing independently. Only certified professional technicians may perform maintenance; always unplug mains plug before repair work to eliminate electrical hazards.